Feature:
Package include:
Holder Base * 1
Stencil Module * 3
Operation Process
1. Put IP X / XS / XS Max main board on the platform
2. Cover and well align the reballing stencil on the motherboard
3. Evenly smear solder paste on the stencil
4. Heat with hot air gun to solidify the solder paste
5. Cool down for a while then separate the stencil from from the motherboard
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Original carton box packing
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