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MJ 3D BGA Reballing Stencil For iPhone 6~ iPhone 11 Pro Max 

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MJ 3D BGA Reballing Stencil For iPhone 6~ iPhone 11 Pro Max 


Compatibility
For iPhone 6~ iPhone 11 Pro Max

Features
  • High-quality steel sheet stencil, more durable
  • Precise laser cutting for better alignment
  • High-temperature resistance, not easy to get deformed
  • The CPU and the common fault ICs are integrated into one stencil
  • IC numbers are lasered on the stencil for reference, much easier to find

Purchase by set to save 5%
You can also purchase separately if you do not need all, this set includes
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Packing
Original carton box packing

Tips for Installation
●  Special tooling is required when BGA reballing the IC chips and CPU
● The installation of any new parts should be done by a qualified person. we are not responsible for any damage caused during installation.

After-sale service
Please feel free to contact us for any problems at any time: service@fanscreate.com
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