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MJ A11 3D BGA Reballing Stencil For iPhone 8/8+/X

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MJ  A11 3D BGA Reballing Stencil For iPhone 8/8+/X

Compatibility
For iPhone 8/8+/X

Features
  • High-quality steel sheet stencil, more durable
  • Precise laser cutting for better alignment
  • High-temperature resistance, not easy to get deformed
  • The CPU and the common fault ICs are integrated into one stencil
  • IC numbers are lasered on the stencil for reference, much easier to find

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Packing
Original carton box packing

Tips for Installation
●  Special tooling is required when GBA reballing the IC chips and CPU
● The installation of any new parts should be done by a qualified person. Fanscreate is not responsible for any damage caused during installation.

After-sale service
Please feel free to contact us for any problems at any time: service@fanscreate.com
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