The motherboard disassembles the platform heating groove for mobile phone - T12A - F including the heating area, Fingerprint repair heating slot, IC slot, Universal heating slot, Silicone insulation, High purity copper film, Screen bracket in addition to glue. It is used to bracket heating degumming, IC heating degumming, Universal heating and removing glue, Fingerprint repair, and glue removal.
Note
This item is just including the mobile phone - T12A - F motherboard heating groove, not including the heating station's main unit.
● Model: T12A - F
● motherboard heating groove size: 126*72*18 mm (L*W*H)
● Net weight: 363 g
● Temperature: 100-280℃
For Mobile Phone
● Accurate temperature control and temperature adjustable.
● Offers heat evenly to protect the motherboard from damage.
● High purity copper is used as a film to ensure uniform heat transfer and heat.
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Original package + carton box
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