Relife 10CC RL-403 183℃ No-Clean Syringe BGA Tin Solder Paste
Specification:
Name: Relife RL-403 183℃ solder paste (syringe)
Specifications: 10cc
Alloy: Sn63/Pb37
Microns: 20-38um
Features:
Good adhesion. Paste delicate, particles small, only 20~38 microns.
Excellent wettability. After opening, the surface remains moist for 36 hours. Does not affect the welding.
Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding
Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃ / forming fast and easy to weld conductive
Package includes:
1pc x Relife RL-403 Solder Paste
After Service:
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